William J. Lypen

AP Avago Technologies Wireless Ip (Singapore) Pte.: 1 patents #67 of 133Top 55%

📍 Windsor, CO: #151 of 237 inventorsTop 65%

🗺 Colorado: #24,093 of 40,980 inventorsTop 60%

Overall (All Time): #3,256,073 of 4,157,543Top 80%

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
7977799	Planar packageless semiconductor structure with via and coplanar contacts	Rick Snyder	2011-07-12