Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9383519 | Optical communication module with fiber submount and latching optics assembly | — | 2016-07-05 |
| 9176289 | Pluggable data communication module with compliant push-pull tab | — | 2015-11-03 |
| 8790022 | Pluggable data communication module with slider-crank delatch mechanism | — | 2014-07-29 |
| 8517616 | Optoelectronic module having an adapter for use in extracting the module from a cage | — | 2013-08-27 |
| 8500342 | Opto-electronic communication module having retainer for aligning optical ports | Paul Yu | 2013-08-06 |
| 8485739 | Optical transceiver module having a deformable heat sink structure | Paul Yu | 2013-07-16 |
| 8467190 | Balanced cooling system and method for high-density stacked cages | Paul Yu | 2013-06-18 |
| 8308377 | Delatch device having both push and pull operability for use with an optical transceiver module, and a method | — | 2012-11-13 |
| 8244081 | Passive alignment using elastic averaging in optoelectronics applications | Brenton A. Baugh, James H. Williams, Robert Wilson, Richard Ruh | 2012-08-14 |
| 7764853 | Passive alignment using elastic averaging in optoelectronics applications | Brenton A. Baugh, James H. Williams, Robert Wilson, Richard Ruh | 2010-07-27 |
| 7473039 | Axis translation installation mechanism for optoelectronics modules and method | Brenton A. Baugh, James H. Williams | 2009-01-06 |
| 7454105 | Passive alignment using elastic averaging in optoelectronics applications | Brenton A. Baugh, James H. Williams, Robert Wilson, Richard Ruh | 2008-11-18 |
| 7255495 | Axis translation installation mechanism for optoelectronic modules | Brenton A. Baugh, James H. Williams | 2007-08-14 |
| 7233723 | Optoelectronic assembly with coupling features for alignment | James H. Williams, Brenton A. Baugh, Robert Wilson, Kendra Gallup | 2007-06-19 |
| 7202553 | Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging | Tanya Jegeris Snyder, Robert Wilson | 2007-04-10 |
| 7176106 | Wafer bonding using reactive foils for massively parallel micro-electromechanical systems packaging | Tanya Jegeris Snyder, Robert Wilson | 2007-02-13 |