Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12166146 | Isolation device and method of transmitting a signal across an isolation material using wire bonds | Kok Keong Richard Lum | 2024-12-10 |
| 11621364 | Isolation device and method of transmitting a signal across an isolation material using wire bonds | Kok Keong Richard Lum | 2023-04-04 |
| 7736070 | Double mold optocoupler | Soo Kiang Ho, Thiam Siew Gary Tay | 2010-06-15 |