Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5449955 | Film circuit metal system for use with bumped IC packages | Michael D. Evans, Warren J. Pendergast | 1995-09-12 |
| 4200975 | Additive method of forming circuit crossovers | William T. Wydra | 1980-05-06 |