Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830999 | Method of fabricating flip chip semiconductor device utilizing polymer layer for reducing thermal expansion coefficient differential | — | 2004-12-14 |
| 6778734 | Thermally tunable fiber devices with microcapillary heaters | Kirk W. Baldwin, Benjamin John Eggleton, Kenneth S Feder, Robert A. Macharrie, John A. Rogers +2 more | 2004-08-17 |
| 6753118 | Optical grating fabrication process | Benjamin John Eggleton, Pavel Ivanoff Reyes, Carl Edmund Soccolich, Michael Sumetsky, Paul S. Westbrook | 2004-06-22 |
| 6441473 | Flip chip semiconductor device | — | 2002-08-27 |
| 5672913 | Semiconductor device having a layer of gallium amalgam on bump leads | Daniel F. Baldwin | 1997-09-30 |
| 5249733 | Solder self-alignment methods | Michael Brady | 1993-10-05 |