Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10572622 | Interconnect reuse resolution with bump compensation in a package design | John Medina | 2020-02-25 |
| 5678117 | Film processor for X-ray film | Edgar Alzner, Dennis W. Allmer | 1997-10-14 |
| 4475983 | Base metal composite electrical contact material | Martin L. Green | 1984-10-09 |