Bruce E. Kornfeld

AT AT&T: 1 patents #10,626 of 18,772Top 60%

Overall (All Time): #3,737,214 of 4,157,543Top 90%

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Showing 1–1 of 1 patents

Patent #	Title	Co-Inventors	Date
5495394	Three dimensional die packaging in multi-chip modules	Arthur R. Alexander	1996-02-27