Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 5622895 | Metallization for polymer-dielectric multichip modules | Aaron Frank, Douglas B. Johnson, Dennis L. Krause, Trac Nguyen | 1997-04-22 |
| 5466972 | Metallization for polymer-dielectric multichip modules including a Ti/Pd alloy layer | Aaron Frank, Douglas B. Johnson, Dennis L. Krause, Trac Nguyen | 1995-11-14 |
| 5356526 | Copper-based metallizations for hybrid integrated circuits | Robert P. Frankenthal, Dennis L. Krause | 1994-10-18 |
| 5288951 | Copper-based metallizations for hybrid integrated circuits | Robert P. Frankenthal, Dennis L. Krause | 1994-02-22 |