Issued Patents All Time
Showing 1–16 of 16 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7334595 | Cabinet for chemical delivery with solvent purging and removal | Charles Michael Birtcher, Martin Castaneda Martinez, Thomas Andrew Steidl, Gil Vivanco | 2008-02-26 |
| 7290572 | Method for purging a high purity manifold | — | 2007-11-06 |
| 7198056 | High purity chemical delivery system | — | 2007-04-03 |
| 7198072 | Purgeable manifold system | — | 2007-04-03 |
| 7114522 | Adapter manifold with dual valve block | — | 2006-10-03 |
| 7114531 | System and method for purging high purity interfaces | — | 2006-10-03 |
| 6953047 | Cabinet for chemical delivery with solvent purging | Charles Michael Birtcher, Martin Castaneda Martinez, Thomas Andrew Steidl, Gil Vivanco | 2005-10-11 |
| 6648034 | Purgeable manifold for low vapor pressure chemicals containers | Charles Michael Birtcher, Martin Castaneda Martinez, Thomas Andrew Steidl, Gil Vivanco | 2003-11-18 |
| 6431229 | Solventless purgeable diaphragm valved manifold for low vapor pressure chemicals | Charles Michael Birtcher, Robert Sam Zorich, Thomas Andrew Steidl, Gil Vivanco, Cynthia Lee Trent | 2002-08-13 |
| 6341615 | Self-cleaning vacuum purge system | Robert Sam Zorich | 2002-01-29 |
| 5764488 | Printed circuit board having a dual pattern footprint for receiving one of two component packages | Mitchell G. Dorfmeyer | 1998-06-09 |
| 5751557 | Printed circuit board having a triple pattern footprint for receiving one of three component packages | — | 1998-05-12 |
| 5682297 | Dual pattern microprocessor package footprint | — | 1997-10-28 |
| 5557505 | Dual pattern microprocessor package footprint | — | 1996-09-17 |
| D365084 | Solder pad for printed circuit boards | Edward D. Suski, Glenn G. Miner | 1995-12-12 |
| 5414223 | Solder pad for printed circuit boards | Edward D. Suski, Glenn G. Miner | 1995-05-09 |