LC

Lo K. Chan

AA Asm Assembly Automation: 4 patents #23 of 182Top 15%
Overall (All Time): #1,302,966 of 4,157,543Top 35%
4
Patents All Time

Issued Patents All Time

Showing 1–4 of 4 patents

Patent #TitleCo-InventorsDate
4826069 Work chuck for wire bonder and method Yui Cheung 1989-05-02
4606490 Apparatus and method for automatic evaluation of a bond created by an ultrasonic transducer Heico J. Frima 1986-08-19
4603803 Wire bonding apparatus Wai Sau Li 1986-08-05
4550871 Four-motion wire bonder Yui Kin Tang, Jui-Ling Chang 1985-11-05