KS

Koichiro Shimoda

AE Asahi Kasei E-Materials: 1 patents #57 of 141Top 45%
Overall (All Time): #2,876,699 of 4,157,543Top 70%
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Patent #TitleCo-InventorsDate
9896546 Resin composition, layered product, multilayer printed wiring board, multilayer flexible wiring board and manufacturing method of the same Yasuhito Iizuka, Masaki Yamamoto, Yoro Sasaki, Hiroaki Adachi, Shuji Kashiwagi 2018-02-20