Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11192979 | Polyamide composition and molded article | Shinji Ieda, Koichi Nagase, Hisho Yamada, Jun Mikami, Takayuki WAKITA +4 more | 2021-12-07 |
| 7927514 | Microcapsule-based hardener for epoxy resin, masterbatch-based hardener composition for epoxy resin, one-part epoxy resin composition, and processed good | Hiroshi Uchida, Kazuhiro Daikai | 2011-04-19 |
| 7854860 | High-stability microencapsulated hardened for epoxy resin and epoxy resin composition | Hiroshi Uchida, Kazuhiro Daikai | 2010-12-21 |