Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7932319 | Thermosetting resin composition and semiconductor sealing medium | Takayuki Matsuda, Hideaki Takahashi | 2011-04-26 |
| 7820772 | Hardener for epoxy resin and epoxy resin composition | Taketoshi Usui, Kazuhiko Yamamoto, Kazuhiro Daikai | 2010-10-26 |