Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6538336 | Wirebond assembly for high-speed integrated circuits | David A. Secker | 2003-03-25 |
| 4360542 | Process for the preparation of thin films of cadmium sulfide and precursor solutions of cadmium ammonia thiocyanate complex useful therein | Otto Loeffler, Otto S. Kauder | 1982-11-23 |