Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12394731 | Compression structures for IC packages | Helia Rahmani, Stephane J. Marcadet, Scott J. Campbell, Zhiyong Xia, Stephen V. Jayanathan +1 more | 2025-08-19 |
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Vineet Negi
Overall (All Time): #2,449,531 of 4,157,543Top 60%
1
Patents All Time