Issued Patents All Time
Showing 51–75 of 95 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8789924 | Actuatable device with die and integrated circuit element | Andreas Bibl, Deane A. Gardner, Kevin Von Essen | 2014-07-29 |
| 8789573 | Micro device transfer head heater assembly and method of transferring a micro device | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2014-07-29 |
| 8646505 | Micro device transfer head | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2014-02-11 |
| 8579412 | Actuatable device with die and integrated circuit element | Andreas Bibl, Deane A. Gardner, Kevin Von Essen | 2013-11-12 |
| 8573469 | Method of forming a micro LED structure and array of micro LED structures with an electrically insulating layer | Hsin-Hua Hu, Andreas Bibl, Hung-Fai Stephen Law | 2013-11-05 |
| 8558243 | Micro device array for transfer to a receiving substrate | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2013-10-15 |
| 8552436 | Light emitting diode structure | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2013-10-08 |
| 8551692 | Forming a funnel-shaped nozzle | Gregory De Brabander, Mark Nepomnishy | 2013-10-08 |
| 8523323 | Method and apparatus for mounting a fluid ejection module | Kevin von Essen, Stephen R. Deming, Nobuo Matsumoto, Andreas Bibl | 2013-09-03 |
| 8523322 | Non-wetting coating on a fluid ejector | Yoshimasa Okamura, Jeffrey Birkmeyer, Gregory DeBrabander, Paul A. Hoisington, Andreas Bibl | 2013-09-03 |
| 8518204 | Method of fabricating and transferring a micro device and an array of micro devices utilizing an intermediate electrically conductive bonding layer | Hsin-Hua Hu, Andreas Bibl, Hung-Fai Stephen Law | 2013-08-27 |
| 8426227 | Method of forming a micro light emitting diode array | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2013-04-23 |
| 8349116 | Micro device transfer head heater assembly and method of transferring a micro device | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2013-01-08 |
| 8333860 | Method of transferring a micro device | Andreas Bibl, Hung-Fai Stephen Law, Hsin-Hua Hu | 2012-12-18 |
| 8297742 | Bonded circuits and seals in a printing device | Kevin Von Essen, Andreas Bibl | 2012-10-30 |
| 8287093 | Drop ejection assembly | Paul A. Hoisington, Andreas Bibl | 2012-10-16 |
| 8272717 | Jetting device with reduced crosstalk | Paul A. Hoisington, Christoph Menzel, Andreas Bibl, Kevin Von Essen | 2012-09-25 |
| 8240796 | Fluid ejector housing insert | Kevin Von Essen, Andreas Bibl, Steve Deming, Mats G. Ottosson | 2012-08-14 |
| 8231202 | Droplet ejection apparatus alignment | Andreas Bibl, Alan W. Menard, Sandra Graveson | 2012-07-31 |
| 8226208 | Non-wetting coating on a fluid ejector | Yoshimasa Okamura, Jeffrey Birkmeyer, Gregory De Brabander, Paul A. Hoisington, Andreas Bibl | 2012-07-24 |
| 8162466 | Printhead having impedance features | Andreas Bibl, Paul A. Hoisington, Deane A. Gardner, Robert Hasenbein, Melvin L. Biggs +1 more | 2012-04-24 |
| 8128201 | Non-wetting coating on a fluid ejector | Yoshimasa Okamura, Jeffrey Birkmeyer | 2012-03-06 |
| 8053956 | Piezoelectric actuators | Andreas Bibl | 2011-11-08 |
| 7997684 | Flexible printhead circuit | Kevin Von Essen, Antai Xu, Andreas Bibl | 2011-08-16 |
| 7837310 | Fluid deposition device | Michael Rocchio, Jeffrey Birkmeyer, Stephen R. Deming, Kevin Von Essen, Andreas Bibl +2 more | 2010-11-23 |