| 12362777 |
Electronic device housing having a radio-frequency transmissive component |
Daniel R. Bloom, Chelsea E. Wojeski, Nathan Morris, Ryan S. Haley, Tian Shi Li +1 more |
2025-07-15 |
| 12323755 |
Headphones |
Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer +6 more |
2025-06-03 |
| 12238469 |
Headphones with increased back volume |
Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian |
2025-02-25 |
| 12190898 |
Audio modification using interconnected electronic devices |
Kathleen A. Bergeron, Jeffrey J. Terlizzi |
2025-01-07 |
| 12177624 |
Earbuds |
Phillip Qian, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater +1 more |
2024-12-24 |
| 12096175 |
Headphones with a curved mesh headband |
Dustin A. Hatfield, Michael B. Minerbi, Eugene Antony Whang, Benjamin A. Shaffer, Daniel R. Bloom |
2024-09-17 |
| 11985462 |
Headphones |
Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin A. Shaffer, Christopher J. Stringer +6 more |
2024-05-14 |
| 11985463 |
Headphones with increased back volume |
Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian |
2024-05-14 |
| 11784673 |
Electronic device housing having a radio-frequency transmissive component |
Daniel R. Bloom, Chelsea E. Wojeski, Nathan Morris, Ryan S. Haley, Tian Shi Li +1 more |
2023-10-10 |
| 11776555 |
Audio modification using interconnected electronic devices |
Kathleen A. Bergeron, Jeffrey J. Terlizzi |
2023-10-03 |
| 11736847 |
Support structure for earpiece cushion |
Dustin A. Hatfield, Michael B. Minerbi, Eugene Antony Whang, Benjamin A. Shaffer, Daniel R. Bloom |
2023-08-22 |
| 11700471 |
Headphones with an anti-buckling assembly |
Daniel R. Bloom, Jason J. LeBlanc, Phillip Qian |
2023-07-11 |
| 11678106 |
Earbuds |
Phillip Qian, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater +1 more |
2023-06-13 |
| 11518138 |
Using woven fibers to increase tensile strength and for securing attachment mechanisms |
Douglas J. Weber, Hsiang Hung Chen, Naoto Matsuyuki, Yoji Hamada, Teodor Dabov +2 more |
2022-12-06 |
| 11477558 |
Headphones |
Daniel R. Bloom, Lee M. Panecki, Phillip Qian, Benjamin Andrew Shaffer, Christopher J. Stringer +6 more |
2022-10-18 |
| 11457300 |
Support structure for earpiece cushion |
Dustin A. Hatfield, Michael B. Minerbi, Eugene Antony Whang, Benjamin Andrew Shaffer, Daniel R. Bloom |
2022-09-27 |
| 11450999 |
Separable articulating power and data interface |
Eric T. SooHoo, Mahmoud R. Amini, Daniel R. Bloom, Sean T. McIntosh, Tian Shi Li +9 more |
2022-09-20 |
| 11277679 |
Headphone earcup structure |
Jarrett B. Lagler, Michael B. Minerbi, Miikka O. Tikander, Lee M. Panecki, Trang Fisher +12 more |
2022-03-15 |
| 11259107 |
Headphone earpads with textile layer having a low porosity region |
Mike B. Minerbi, Benjamin Andrew Shaffer, Eugene Antony Whang, Miikka O. Tikander, Derek W. Wright +5 more |
2022-02-22 |
| 11184696 |
Wireless headphones with slot antenna |
Tian Shi Li, Daniel R. Bloom, Jerzy S. Guterman, Jue Wang, Toni Ristoski +2 more |
2021-11-23 |
| 11159869 |
Eartip with control leak |
Scott C. Grinker, Esge B. Andersen, Ethan L. Huwe, Benjamin A. Cousins, Samuel G. Parker +4 more |
2021-10-26 |
| 11134328 |
Headphones with magnetic sensor |
Jared M. Kole, Daniel R. Bloom, Audrey L. Sheng, Tian Shi Li, Eugene Antony Whang +13 more |
2021-09-28 |
| 11134327 |
Headphones with telescoping stem assembly |
Jason J. LeBlanc, Daniel R. Bloom, Phillip Qian, Lee M. Panecki, Eugene Antony Whang +3 more |
2021-09-28 |
| 10924836 |
Techniques for improving glass earcup drop performance |
Jason C. Zapantis, Christopher D. Jones, Edwin J. Corona Aparicio, Daniel R. Bloom |
2021-02-16 |
| 10856068 |
Earbuds |
Phillip Qian, Erik L. Wang, Christopher J. Stringer, Matthew Dean Rohrbach, Daniel Max Strongwater +1 more |
2020-12-01 |
