Issued Patents All Time
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10953433 | Method for smoothing substrate surface | William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque | 2021-03-23 |
| 10897825 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2021-01-19 |
| 10617016 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2020-04-07 |
| 10350634 | Method for smoothing substrate surface | William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque | 2019-07-16 |
| 10264685 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2019-04-16 |
| 9907191 | Multi-part electronic device housing having contiguous filled surface | Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan | 2018-02-27 |
| 9710023 | Treatment of substrate sub-surface | Ming Kun Shi, Jason O. Mettler, Hilbert T. Kwan, Qi Tian, Jing EF Zhang +3 more | 2017-07-18 |