| 10953433 |
Method for smoothing substrate surface |
William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque |
2021-03-23 |
| 10897825 |
Multi-part electronic device housing having contiguous filled surface |
Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan |
2021-01-19 |
| 10617016 |
Multi-part electronic device housing having contiguous filled surface |
Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan |
2020-04-07 |
| 10350634 |
Method for smoothing substrate surface |
William F. Leggett, Ming Kun Shi, Simon R. Lancaster-Larocque |
2019-07-16 |
| 10264685 |
Multi-part electronic device housing having contiguous filled surface |
Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan |
2019-04-16 |
| 9907191 |
Multi-part electronic device housing having contiguous filled surface |
Ming Kun Shi, Lindsay D. Corbet, Collin D. Chan |
2018-02-27 |
| 9710023 |
Treatment of substrate sub-surface |
Ming Kun Shi, Jason O. Mettler, Hilbert T. Kwan, Qi Tian, Jing EF Zhang +3 more |
2017-07-18 |
