Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10854557 | Semiconductor device packaging with metallic shielding layer | Koji IWABU, Katsuhiro TAKAO, Akihito Hirai, Joichi Saito | 2020-12-01 |
| 10854560 | Semiconductor device and semiconductor device manufacturing method | Koji IWABU, Katsuhiro TAKAO, Akihito Hirai, Joichi Saito | 2020-12-01 |