Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10980127 | Methods for fabricating printed circuit board assemblies with high density via array | Michael Len, Chong Mei, Raj Kumar | 2021-04-13 |
| 8044749 | Coupler device | Tomasz M. Witas, Niels H. Kirkeby | 2011-10-25 |
| 7728694 | Surface mount stripline devices having ceramic and soft board hybrid materials | Bo Jensen, Adam J. Gadway | 2010-06-01 |