Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9270003 | Stripline assembly having first and second pre-fired ceramic substrates bonded to each other through a conductive bonding layer | Benton O'Neil, Adam Cook | 2016-02-23 |
| 9178257 | First and second microstrip networks stacked in an inverted arrangement to each other using an integrated support and shielding structure | Michael Enders | 2015-11-03 |