Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7777313 | Electronic package structures and methods | Joseph Bergeron | 2010-08-17 |
| 6476471 | Microelectronic-device assemblies and methods that exclude extraneous elements from sensitive areas | — | 2002-11-05 |
| 6163462 | Stress relief substrate for solder ball grid array mounted circuits and method of packaging | — | 2000-12-19 |
| 5489854 | IC chip test socket with double-ended spring biased contacts | David N. Tesh | 1996-02-06 |
| 5021120 | Process for etching patterned substrates | Darrell P. Adams | 1991-06-04 |
| 4957583 | Apparatus for etching patterned substrates | Darrell P. Adams | 1990-09-18 |