Issued Patents All Time
Showing 126–140 of 140 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4445271 | Ceramic chip carrier with removable lead frame support and preforated ground pad | — | 1984-05-01 |
| 4426769 | Moisture getter for integrated circuit packages | — | 1984-01-24 |
| 4419818 | Method for manufacturing substrate with selectively trimmable resistors between signal leads and ground structure | — | 1983-12-13 |
| 4417266 | Power and ground plane structure for chip carrier | — | 1983-11-22 |
| 4410905 | Power, ground and decoupling structure for chip carriers | — | 1983-10-18 |
| 4410906 | Very high speed large system integration chip package and structure | — | 1983-10-18 |
| 4408815 | High compliance roll-in channel wire termination | Samuel W. Apicelli | 1983-10-11 |
| 4408218 | Ceramic chip carrier with lead frame having removable rim | — | 1983-10-04 |
| 4402561 | Socket for integrated circuit package with extended leads | Iosif Korsunsky | 1983-09-06 |
| 4370017 | Complanate contact terminal | Iosif Korsunsky | 1983-01-25 |
| 4370012 | Electrical connector for circuit board or substrate | Iosif Korsunsky | 1983-01-25 |
| 4362902 | Ceramic chip carrier | — | 1982-12-07 |
| 4354729 | Preloaded electrical contact terminal | Iosif Korsunsky | 1982-10-19 |
| 4268102 | Low impedance electrical connecting means for spaced-apart conductors | — | 1981-05-19 |
| 4195193 | Lead frame and chip carrier housing | Ronald Patterson | 1980-03-25 |