ML

Moo Eung Lee

AT Amkor Technology: 1 patents #386 of 595Top 65%
AS Asemiconductor: 1 patents #3 of 8Top 40%
Overall (All Time): #3,642,251 of 4,157,543Top 90%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5872399 Solder ball land metal structure of ball grid semiconductor package — 1999-02-16