EK

Eun-Deok Kim

AT Amkor Technology: 1 patents #386 of 595Top 65%
Overall (All Time): #3,519,939 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
6605865 Semiconductor package with optimized leadframe bonding strength Jung Ho Jeong, Jong-Chul Hong 2003-08-12