Byong II Heo

AT Amkor Technology: 2 patents #266 of 595Top 45%

📍 Gwangju, KR: #558 of 1,647 inventorsTop 35%

Overall (All Time): #2,109,666 of 4,157,543Top 55%

Patents All Time

Issued Patents All Time

Showing 1–2 of 2 patents

Patent #	Title	Co-Inventors	Date
7982297	Stackable semiconductor package having partially exposed semiconductor die and method of fabricating the same	—	2011-07-19
7009296	Semiconductor package with substrate coupled to a peripheral side surface of a semiconductor die	—	2006-03-07