CK

Cheol W. Kwak

AE Amkor Electronics: 1 patents #12 of 35Top 35%
LI Lp Industries: 1 patents #16 of 47Top 35%
Overall (All Time): #3,759,135 of 4,157,543Top 95%
1
Patents All Time

Issued Patents All Time

Patent #TitleCo-InventorsDate
5582772 Copper oxide-filled polymer die attach adhesive composition for semiconductor package — 1996-12-10