Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9343418 | Solder bump arrangements for large area analog circuitry | Donnacha Lowney, Christopher M. Gorman | 2016-05-17 |
| 9128148 | Package integrity monitor with sacrificial bumps | Donnacha Lowney | 2015-09-08 |