Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6607423 | Method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning | Rigel G. Arcayan, Michael K. Burleson | 2003-08-19 |
| 6309277 | System and method for achieving a desired semiconductor wafer surface profile via selective polishing pad conditioning | Rigel G. Arcayan, Michael K. Burleson | 2001-10-30 |