Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9839159 | Dispense pattern for thermal interface material for a high aspect ratio thermal interface | — | 2017-12-05 |
| 8742477 | Elliptical through silicon vias for active interposers | — | 2014-06-03 |
| 8704364 | Reducing stress in multi-die integrated circuit structures | — | 2014-04-22 |
| 8384225 | Through silicon via with improved reliability | Arifur Rahman | 2013-02-26 |