Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9560771 | Ball grid array and land grid array having modified footprint | Wei-Feng Lin, Kah-Ong Tan | 2017-01-31 |
| 8072489 | Digital camera module using stacked chip package | Ying-Cheng Wu | 2011-12-06 |
| 7374431 | Clamping device for digital camera module | — | 2008-05-20 |