Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11285569 | Soldering material based on Sn Ag and Cu | Hans-Jurgen Albrecht, Gunnar Petzold, Klaus Wilke, Klaus Heinrich Georg Bartl, Klaus Müller +3 more | 2022-03-29 |
| 10376994 | Soldering material based on Sn Ag and Cu | Hans-Jurgen Albrecht, Klaus Heinrich Georg Bartl, Werner Kruppa, Klaus Müller, Mathias Nowottnick +3 more | 2019-08-13 |
| 6648210 | Lead-free solder alloy powder paste use in PCB production | — | 2003-11-18 |