Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11170926 | Isolated coupling structure | Jung-Pei Cheng, Hsiang-Chung Chang, Yu-Ming Chen, Chieh-Wen Cheng, Tsung-Han Ou | 2021-11-09 |
| 8659128 | Flip chip package structure with heat dissipation enhancement and its application | Yu-Lin Yang | 2014-02-25 |