Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11809441 | Wafer-level package assembly handling | Edward Andrew Condon | 2023-11-07 |
| 5337553 | Endothermic fluid based thermal management method | — | 1994-08-16 |
| 5313790 | Endothermic fluid based thermal management system | — | 1994-05-24 |