SL

Shixi Louis Liu

AM Allegro Microsystems: 17 patents #33 of 406Top 9%
TS Triquint Semiconductor: 2 patents #53 of 243Top 25%
📍 Hooksett, NH: #3 of 91 inventorsTop 4%
🗺 New Hampshire: #666 of 12,181 inventorsTop 6%
Overall (All Time): #229,566 of 4,157,543Top 6%
19
Patents All Time

Issued Patents All Time

Showing 1–19 of 19 patents

Patent #TitleCo-InventorsDate
12282075 Sensor package and system Simon E. Rock, Georges El Bacha, Shaun D. Milano, Loïc André Messier, Alexander Latham +1 more 2025-04-22
12183662 Signal isolator having enhanced creepage characteristics Robert A. Briano, William P. Taylor 2024-12-31
12163983 Packaged current sensor integrated circuit Robert A. Briano, Natasha Healey 2024-12-10
11973008 Signal isolator having enhanced creepage characteristics Robert A. Briano, William P. Taylor 2024-04-30
11768230 Current sensor integrated circuit with a dual gauge lead frame Maxwell McNally, Alexander Latham 2023-09-26
11644485 Current sensor integrated circuits Paul A. David, Natasha Healey 2023-05-09
11519939 Current sensor integrated circuits Paul A. David, Shaun D. Milano, Rishikesh Nikam, Alexander Latham, Wade Bussing +2 more 2022-12-06
11519946 Packaged current sensor integrated circuit Simon E. Rock, Alexander Latham, Robert A. Briano 2022-12-06
11289406 Signal isolator having enhanced creepage characteristics Robert A. Briano, William P. Taylor 2022-03-29
11183436 Power module package and packaging techniques Natasha Healey, Rishikesh Nikam 2021-11-23
11150273 Current sensor integrated circuits Paul A. David, Shaun D. Milano, Rishikesh Nikam, Alexander Latham, Wade Bussing +2 more 2021-10-19
10753963 Current sensor isolation Shaun D. Milano 2020-08-25
10345343 Current sensor isolation Shaun D. Milano 2019-07-09
10049969 Integrated circuit 2018-08-14
9865807 Packaging for an electronic device Harianto Wong, Paul A. David, John Sauber, Shaun D. Milano, Raguvir Kanda +1 more 2018-01-09
9190384 Preform including a groove extending to an edge of the preform Wenlong Ma, Frank Hin-Fai Chau, Barry Jia-Fu Lin 2015-11-17
9190606 Packaging for an electronic device Harianto Wong, Paul A. David, John Sauber, Shaun D. Milano, Raguvir Kanda +1 more 2015-11-17
D719115 Housing for an electronic device Harianto Wong, Paul A. David, John Sauber, Shaun D. Milano, Raguvir Kanda +1 more 2014-12-09
8718720 Die including a groove extending from a via to an edge of the die Wenlong Ma, Frank Hin-Fai Chau, Barry Jia-Fu Lin 2014-05-06