Issued Patents All Time
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8658120 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Satoshi Ibaraki, Yoshinobu Kodani, Takaomi Ikeda | 2014-02-25 |
| 8409756 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi +2 more | 2013-04-02 |
| 8411415 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimormura, Yoshimi Murage, Niro Shiomi +2 more | 2013-04-02 |
| 8362187 | Phenol resin powder, method for producing the same, and phenol resin powder dispersion liquid | Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage | 2013-01-29 |
| 8293860 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi +2 more | 2012-10-23 |
| 8158095 | Non-thermofusible phenol resin powder, method for producing the same, thermosetting resin composition, sealing material for semiconductor, and adhesive for semiconductor | Yoshiharu Wakayama, Satoshi Ibaraki, Jun Shimomura, Yoshimi Murage, Niro Shiomi +2 more | 2012-04-17 |