KC

Kong Hoong Chew

AT Agilent Technologies: 1 patents #1,723 of 3,411Top 55%
📍 Bayan Lepas, MY: #139 of 266 inventorsTop 55%
Overall (All Time): #3,442,013 of 4,157,543Top 85%
1
Patents All Time

Issued Patents All Time

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6858474 Wire bond package and packaging method Hean Tatt Koay, Beng Huat Low 2005-02-22