Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7114939 | Encapsulating brittle substrates using transfer molding | Cheng Why Tan, Beng Huat Low | 2006-10-03 |
| 6806583 | Light source | Seong Choon Lim, Cheng Why Tan, Gurbir Singh, Chee-Keong Chong, Sundar Yoganandan | 2004-10-19 |
| 6242280 | Method of interconnecting an electronic device | Cheng Why Tan, Chee-Keong Chong, Gurbir Singh, Sundar Yoganandan, Seong Choon Lim | 2001-06-05 |