Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6872592 | Methods for providing an integrated circuit package with an alignment mechanism | Sari Christensen, Nicole Butel | 2005-03-29 |
| 6724095 | Apparatus for aligning an integrated circuit package with an interface | Sari Christensen, Nicole Butel | 2004-04-20 |
| 6556454 | High density contact arrangement | Guy Humphrey, Michael J. Welch | 2003-04-29 |
| 6261869 | Hybrid BGA and QFP chip package assembly and process for same | Susan K. Radford | 2001-07-17 |