Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12209012 | Wafer level package for device | — | 2025-01-28 |
| 10669152 | Device arrangement | Navab Singh, Srinivas MERUGU | 2020-06-02 |
| 9505612 | Method for thin film encapsulation (TFE) of a microelectromechanical system (MEMS) device and the MEMS device encapsulated thereof | Jaibir Sharma, Navab Singh | 2016-11-29 |