Issued Patents All Time
Showing 26–27 of 27 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7192841 | Method of wafer/substrate bonding | Jun Wei, Zhiping Wang | 2007-03-20 |
| 7030257 | Metallocenes and processes for their preparation | Zhiqiang Gao, Fang Xie | 2006-04-18 |