Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11948861 | Liquid cooling module and method of forming the same | Yong Han, Boon Long Lau, Xiaowu Zhang | 2024-04-02 |
| 11515237 | Plurality of heat sinks for a semiconductor package | Kazunori Yamamoto, Xiaowu Zhang | 2022-11-29 |