Issued Patents All Time
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7335990 | Process of forming a composite diffusion barrier in copper/organic low-k damascene technology | Siaw Suian Sabrina Su, Moitreyee Mukherjee-Roy, Ramana Murthy Badam | 2008-02-26 |
| 7244674 | Process of forming a composite diffusion barrier in copper/organic low-k damascene technology | Siaw Suian Sabrina Su, Moitreyee Mukherjee-Roy, Ramana Murthy Badam | 2007-07-17 |
| 6872657 | Method to form copper seed layer for copper interconnect | DAO ZHANG | 2005-03-29 |