| 12119142 |
Film, method for producing film, metal-clad laminate, and coated metal conductor |
Tomoya Hosoda, Atsumi Mitsunaga, Tatsuya Terada, Sota Yuki |
2024-10-15 |
| 12083767 |
Long film, method for producing long film, method for producing long multilayer body, and long multilayer body |
Yuya HORIGUCHI, Seigo Kotera, Tomoya Hosoda |
2024-09-10 |
| 11978557 |
Diagnosis support system and method |
Kempei Takemoto, Yuki Aoyama |
2024-05-07 |
| 11632859 |
Long laminate, method for its production and printed wiring board |
Tomoya Hosoda, Atsumi Yamabe |
2023-04-18 |
| 11535015 |
Molded product, metal-clad laminate, printed wiring board, and methods for their production |
Tomoya Hosoda |
2022-12-27 |
| 11370200 |
Fluororesin film and laminate, and method for producing hot pressed laminate |
Tomoya Hosoda, Tatsuya Terada, Atsumi Yamabe, Nobutaka KIDERA |
2022-06-28 |
| 11098170 |
Film and method for its production |
Masami Suzuki |
2021-08-24 |
| 10940629 |
Ethylene-tetrafluoroethylene copolymer film and method for producing same |
Kengo Kawahara |
2021-03-09 |
| 10913183 |
Process for producing package for mounting a semiconductor element and mold release film |
— |
2021-02-09 |
| 10844153 |
Material for printed circuit board, metal laminate, methods for producing them, and method for producing printed circuit board |
Tomoya Hosoda, Toru Sasaki, Masatoshi Abe |
2020-11-24 |
| 10807776 |
Resin film and process for its production |
Daisuke TAGUCHI, Yoshiaki Higuchi |
2020-10-20 |
| 10729018 |
Process for producing laminate and process for producing printed board |
Toru Sasaki |
2020-07-28 |
| 10716203 |
Adhesive film and flexible metal laminate |
Tomoya Hosoda, Eiichi Nishi, Toru Sasaki, Yasuhiko Matsuoka |
2020-07-14 |
| 10699916 |
Mold release film, process for its production, and process for producing semiconductor package |
Masami Suzuki |
2020-06-30 |
| 10304583 |
Insulating tape for covering, and method for producing structure |
Tomoya Hosoda, Yasuhiko Matsuoka, Toru Sasaki |
2019-05-28 |
| 10141204 |
Film, method for its production, and method for producing semiconductor element using the film |
Seigo Kotera, Masami Suzuki |
2018-11-27 |
| 9859133 |
Mold release film and process for producing semiconductor package |
Masami Suzuki |
2018-01-02 |
| 9613832 |
Mold release film and process for producing semiconductor package |
Masami Suzuki |
2017-04-04 |
| 9306135 |
Mold release film and method of process for producing a semiconductor device using the same |
Yoshiaki Higuchi, Masakazu Ataku, Daisuke TAGUCHI, Satoshi Otsugu |
2016-04-05 |