Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937386 | Chip package structure with ENIG plating | Sung Chuan MA | 2015-01-20 |
| 8299629 | Wafer-bump structure | Kuei-Wu Chu | 2012-10-30 |
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 8937386 | Chip package structure with ENIG plating | Sung Chuan MA | 2015-01-20 |
| 8299629 | Wafer-bump structure | Kuei-Wu Chu | 2012-10-30 |