Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 4950503 | Process for the coating of a molybdenum base | Paul E. Kutniewski | 1990-08-21 |
| 4768077 | Lead frame having non-conductive tie-bar for use in integrated circuit packages | — | 1988-08-30 |
| 4649229 | All metal flat package for microcircuitry | Steven A. Tower | 1987-03-10 |
| 4633573 | Microcircuit package and sealing method | — | 1987-01-06 |
| 4477828 | Microcircuit package and sealing method | — | 1984-10-16 |
| 4266089 | All metal flat package having excellent heat transfer characteristics | — | 1981-05-05 |
| 4266090 | All metal flat package | — | 1981-05-05 |
| 4262300 | Microcircuit package formed of multi-components | — | 1981-04-14 |