Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 12283569 | Semiconductor device package and a method of manufacturing the same | Wen-Hsin Lin | 2025-04-22 |
| 11587903 | Semiconductor device package and a method of manufacturing the same | Wen-Hsin Lin | 2023-02-21 |
| 11524890 | Semiconductor device packages and methods of manufacturing the same | Yueh-Ju Lin | 2022-12-13 |
| 10229894 | Semiconductor package structure and semiconductor process | Shih-Ming Huang, Chun-Hung Lin, Yi-Ting Chen, Wen-Hsin Lin, Shih-Wei Chan | 2019-03-12 |
| 9978715 | Semiconductor package structure and semiconductor process | Shih-Ming Huang, Chun-Hung Lin, Yi-Ting Chen, Wen-Hsin Lin, Shih-Wei Chan | 2018-05-22 |