Patents per Year
Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12218094 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2025-02-04 | |
| 11935855 | Electronic package structure and method for manufacturing the same | Wei Wang, Tung Yao LIN | 2024-03-19 | $5,352,000 |
| 11817421 | Method for manufacturing semiconductor package structure | Tung Yao LIN, Rong He GUO | 2023-11-14 | $2,510,000 |
| 11652081 | Method for manufacturing semiconductor package structure | Tung Yao LIN, Rong He GUO | 2023-05-16 | $3,764,000 |