Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 12412845 | Semiconductor packages and methods of manufacturing the same | Cheng-Yuan Chen, Chun-Chen Chen, Yuanhao Yu | 2025-09-09 | |
| 12308306 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Cheng-Yuan Chen, Chun-Chen Chen, Chien-Wen Tu | 2025-05-20 | |
| 11824031 | Semiconductor package structure with dielectric structure covering upper surface of chip | Chih-Cheng Lee | 2023-11-21 | $2,495,000 |
| 11658102 | Semiconductor device package and method of manufacturing the same | Yuanhao Yu, Cheng-Yuan Chen, Chun-Chen Chen, Chien-Wen Tu | 2023-05-23 | $2,531,000 |
| 11552026 | Semiconductor packages and methods of manufacturing the same | Cheng-Yuan Chen, Chun-Chen Chen, Yuanhao Yu | 2023-01-10 | $2,405,000 |