Issued Patents All Time
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 7417313 | Method for manufacturing an adhesive substrate with a die-cavity sidewall | Bernd Karl Appelt | 2008-08-26 |
| 7344915 | Method for manufacturing a semiconductor package with a laminated chip cavity | Bernd Karl Appelt | 2008-03-18 |
| 7172926 | Method for manufacturing an adhesive substrate with a die-cavity sidewall | Bernd Karl Appelt | 2007-02-06 |
| 6638438 | Printed circuit board micro hole processing method | Jou-Yuan Tseng, Kang-Tsun Liu | 2003-10-28 |